国际简称:IEEE T RELIAB 参考译名:可靠性交易
主要研究方向:工程技术-工程:电子与电气 非预警期刊 审稿周期: 约4.5个月
《可靠性交易》(Ieee Transactions On Reliability)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技术-工程:电子与电气为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。该期刊享有很高的科学声誉,影响因子不断增加,发行量也同样高。
IEEE Transactions on Reliability is a refereed journal for the reliability and allied disciplines including, but not limited to, maintainability, physics of failure, life testing, prognostics, design and manufacture for reliability, reliability for systems of systems, network availability, mission success, warranty, safety, and various measures of effectiveness. Topics eligible for publication range from hardware to software, from materials to systems, from consumer and industrial devices to manufacturing plants, from individual items to networks, from techniques for making things better to ways of predicting and measuring behavior in the field. As an engineering subject that supports new and existing technologies, we constantly expand into new areas of the assurance sciences.
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||
12.2 | 1.511 | 1.989 |
|
名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
是 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 1区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 2区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
是 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 1区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 2区 2区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q1 | 8 / 59 |
87.3% |
学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING | SCIE | Q1 | 13 / 131 |
90.5% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q1 | 65 / 352 |
81.7% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q1 | 7 / 59 |
88.98% |
学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING | SCIE | Q1 | 14 / 131 |
89.69% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q1 | 42 / 354 |
88.28% |
Author: He, Yan-Lin; Li, Kun; Liang, Li-Long; Xu, Yuan; Zhu, Qun-Xiong
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 166-176. DOI: 10.1109/TR.2021.3115108
Author: Huang, Yanze; Lin, Limei; Lin, Yuhang; Xu, Li; Hsieh, Sun-Yuan
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 372-383. DOI: 10.1109/TR.2021.3129257
Author: Zhang, Ning; Xu, Yuan; Zhu, Qun-Xiong; He, Yan-Lin
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 204-213. DOI: 10.1109/TR.2021.3139539
Author: Wang, Kai; Xu, Zhaoping; Liu, Yu; Fang, Yiping
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 190-203. DOI: 10.1109/TR.2021.3132774
Author: Li, Zheng; Wu, Yonghao; Peng, Bin; Chen, Xiang; Sun, Zeyu; Liu, Yong; Paul, Doyle
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 258-273. DOI: 10.1109/TR.2022.3154773
Author: Kou, Gang; Yi, Kunxiang; Xiao, Hui; Peng, Rui
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 3-14. DOI: 10.1109/TR.2022.3161638
Author: Gong, Hongfang; Li, Renfa; An, Jiyao; Xie, Guoqi
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 224-239. DOI: 10.1109/TR.2022.3160460
Author: Gong, Siqian; Zhu, Xiaomin; Zhang, Runtong; Zhao, Hongmei; Guo, Chao
Journal: IEEE TRANSACTIONS ON RELIABILITY. 2023; Vol. 72, Issue 1, pp. 329-342. DOI: 10.1109/TR.2022.3161359
Engineering Applications Of Artificial Intelligence
中科院 2区 JCR Q1
Icga Journal
中科院 4区 JCR Q4
Egyptian Informatics Journal
中科院 3区 JCR Q1
Computer Vision And Image Understanding
中科院 3区 JCR Q1
Journal Of Grid Computing
中科院 2区 JCR Q1
Ieee Transactions On Dependable And Secure Computing
中科院 2区 JCR Q1
Acm Transactions On Internet Technology
中科院 3区 JCR Q1
Neurocomputing
中科院 2区 JCR Q1
若用户需要出版服务,请联系出版商:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141。