Materials Science In Semiconductor Processing SCIE

国际简称：MAT SCI SEMICON PROC 参考译名：半导体加工中的材料科学

主要研究方向：工程技术-材料科学：综合非预警期刊审稿周期：约1.7个月约3.7周

《半导体加工中的材料科学》(Materials Science In Semiconductor Processing)是一本由Elsevier Ltd出版的以工程技术-材料科学：综合为研究特色的国际期刊，发表该领域相关的原创研究文章、评论文章和综述文章，及时报道该领域相关理论、实践和应用学科的最新发现，旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊，近三年没有被列入预警名单。

3区中科院分区
Q2 JCR分区
635 年发文量
4.2 IF影响因子
未开放 是否OA
49 H-index
1998 创刊年份
Bimonthly 出版周期
English 出版语言

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

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Materials Science In Semiconductor Processing期刊信息

ISSN：1369-8001
出版语言：English
是否OA：未开放
E-ISSN：1873-4081
出版地区：ENGLAND
是否预警：否
出版商：Elsevier Ltd
出版周期：Bimonthly
创刊时间：1998
开源占比：0.0145
Gold OA文章占比：5.21%
OA被引用占比：0.0123...
出版国人文章占比：0.21
出版撤稿占比：0
研究类文章占比：96.22%

Materials Science In Semiconductor Processing CiteScore评价数据（2024年最新版）

CiteScore

SJR

SNIP

CiteScore 指数

0.732

0.992

学科类别	分区	排名	百分位
大类：Engineering 小类：Mechanical Engineering	Q1	87 / 672	87%
大类：Engineering 小类：Condensed Matter Physics	Q1	59 / 434	86%
大类：Engineering 小类：Mechanics of Materials	Q1	60 / 398	85%
大类：Engineering 小类：General Materials Science	Q1	100 / 463	78%

名词解释：CiteScore 是衡量期刊所发表文献的平均受引用次数，是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年（含计算年度）的被引次数除以该期刊近四年发表的文献数。例如，2022年的 CiteScore 计算方法为：2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量注：文献类型包括：文章、评论、会议论文、书籍章节和数据论文。

Materials Science In Semiconductor Processing中科院评价数据

中科院 2023年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用 PHYSICS, CONDENSED MATTER 物理：凝聚态物理	3区 3区 3区 3区

中科院 2022年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	PHYSICS, APPLIED 物理：应用 PHYSICS, CONDENSED MATTER 物理：凝聚态物理 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合	2区 2区 3区 3区

中科院 2021年12月旧的升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用 PHYSICS, CONDENSED MATTER 物理：凝聚态物理	3区 3区 3区 3区

中科院 2021年12月基础版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用 PHYSICS, CONDENSED MATTER 物理：凝聚态物理	3区 4区 3区 3区

中科院 2021年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用 PHYSICS, CONDENSED MATTER 物理：凝聚态物理	3区 3区 3区 3区

中科院 2020年12月旧的升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用 PHYSICS, CONDENSED MATTER 物理：凝聚态物理	3区 3区 3区 3区

Materials Science In Semiconductor Processing JCR评价数据（2023-2024年最新版）

按JIF指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	89 / 352	74.9%
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q2	158 / 438	64%
学科：PHYSICS, APPLIED	SCIE	Q2	51 / 179	71.8%
学科：PHYSICS, CONDENSED MATTER	SCIE	Q2	25 / 79	69%

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	113 / 354	68.22%
学科：MATERIALS SCIENCE, MULTIDISCIPLINARY	SCIE	Q2	125 / 438	71.58%
学科：PHYSICS, APPLIED	SCIE	Q2	47 / 179	74.02%
学科：PHYSICS, CONDENSED MATTER	SCIE	Q1	19 / 79	76.58%

Materials Science In Semiconductor Processing历年数据统计

影响因子

中科院分区

Materials Science In Semiconductor Processing中国学者发文选摘

1、V2O5 nanobelts via a facile water-assisted strategy boosting electrochromic performance
Author: Sun, Haohao; Wang, Wenxuan; Fan, Qiongzhen; Qi, Yanyuan; Xiong, Yuli; Jian, Zelang; Chen, Wen

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 155, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107265
2、Ag/Ag3PO4 nanoparticles assembled on sepiolite nanofibers: Enhanced visible-light-driven photocatalysis and the important role of Ag decoration
Author: Ren, Xiaofei; Hu, Guicong; Guo, Qingbin; Gao, Dengzheng; Wang, Li; Hu, Xiaolong

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107272
3、Exploring the effect of oxygen environment on the Mo/CdTe/CdSe solar cell substrate configuration
Author: Yang, Xiutao; Long, Yuchen; Zheng, Yujie; Wang, Jiayi; Zhou, Biao; Xie, Shenghui; Li, Bing; Zhang, Jingquan; Hao, Xia; Karazhanov, Smagul; Zeng, Guanggen; Feng, Lianghuan

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107267
4、Slag refining at various viscosity conditions for SiC inclusion removal during Si scraps recycling
Author: Pan, Di; Jiang, Dachuan; Hu, Zhiqiang; Li, Pengting; Tan, Yi; Li, Jin; Li, Jiayan

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107274
5、Fabrication of interface-engineered Ni/NiO/rGO nanobush for highly efficient and durable oxygen reduction
Author: Wang, Yanan; Duan, Chunyang; Li, Junhua; Zhao, Zenghua; Xu, Jiasheng; Liu, Lin; Qian, Jianhua

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107259
6、The structural, mechanical and electronic properties of BaxNy compounds
Author: Wang, Gao-Min; Zeng, Wei; Zhang, Fan; Li, Xing-Han; Liu, Fu-Sheng; Tang, Bin; Zhong, Mi; Liu, Qi-Jun

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107268
7、Synergistic effect of 1,2,4-triazole and phytic acid as inhibitors on copper film CMP for ruthenium- based copper interconnected and the surface action mechanism analysis
Author: Luo, Fu; Niu, Xinhuan; Yan, Han; Zhang, Yinchan; Qu, Minghui; Zhu, Yebo; Hou, Ziyang

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107276
8、Hyperspectral camouflage coating using Palygorskite to simulate water absorption of healthy green leaves
Author: Lu, Haipeng; Bai, Xingzhi; Wang, Zhenxiong; Guo, Yang; Zhang, Li; Weng, Xiaolong; Xie, Jianliang; Liang, Difei; Deng, Longjiang

Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. 2023; Vol. 156, Issue , pp. -. DOI: 10.1016/j.mssp.2022.107293