国际简称:SOLID STATE COMMUN 参考译名:固态通信
主要研究方向:物理-物理:凝聚态物理 非预警期刊 审稿周期: 约3.2个月 约6.8周
《固态通信》(Solid State Communications)是一本由Elsevier Ltd出版的以物理-物理:凝聚态物理为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。
Solid State Communications is an international medium for the publication of short communications and original research articles on significant developments in condensed matter science, giving scientists immediate access to important, recently completed work. The journal publishes original experimental and theoretical research on the physical and chemical properties of solids and other condensed systems and also on their preparation. The submission of manuscripts reporting research on the basic physics of materials science and devices, as well as of state-of-the-art microstructures and nanostructures, is encouraged.
A coherent quantitative treatment emphasizing new physics is expected rather than a simple accumulation of experimental data. Consistent with these aims, the short communications should be kept concise and short, usually not longer than six printed pages. The number of figures and tables should also be kept to a minimum. Solid State Communications now also welcomes original research articles without length restrictions.
The Fast-Track section of Solid State Communications is the venue for very rapid publication of short communications on significant developments in condensed matter science. The goal is to offer the broad condensed matter community quick and immediate access to publish recently completed papers in research areas that are rapidly evolving and in which there are developments with great potential impact.
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||||||
3.4 | 0.414 | 0.687 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 物理与天体物理 | 4区 | PHYSICS, CONDENSED MATTER 物理:凝聚态物理 | 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 物理与天体物理 | 4区 | PHYSICS, CONDENSED MATTER 物理:凝聚态物理 | 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 物理与天体物理 | 4区 | PHYSICS, CONDENSED MATTER 物理:凝聚态物理 | 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 物理 | 4区 | PHYSICS, CONDENSED MATTER 物理:凝聚态物理 | 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 物理与天体物理 | 4区 | PHYSICS, CONDENSED MATTER 物理:凝聚态物理 | 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 物理与天体物理 | 4区 | PHYSICS, CONDENSED MATTER 物理:凝聚态物理 | 4区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:PHYSICS, CONDENSED MATTER | SCIE | Q3 | 47 / 79 |
41.1% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:PHYSICS, CONDENSED MATTER | SCIE | Q3 | 52 / 79 |
34.81% |
Author: Zhao, Jian; Huang, Bo -Wen; Gao, Wei; Zheng, Li -Min; Song, Peng-Ze; He, Man-Chao
Journal: SOLID STATE COMMUNICATIONS. 2023; Vol. 366, Issue , pp. -. DOI: 10.1016/j.ssc.2023.115171
Author: Xian, Lijun; Li, Lin; Fan, Hongyuan; Xian, Guang; Zhao, Haibo
Journal: SOLID STATE COMMUNICATIONS. 2023; Vol. 366, Issue , pp. -. DOI: 10.1016/j.ssc.2023.115178
Author: Cao, Wan Q.; Zhang, Lei; Chen, Yong
Journal: SOLID STATE COMMUNICATIONS. 2023; Vol. 360, Issue , pp. -. DOI: 10.1016/j.ssc.2022.115037
Author: Fan, Qingqing; An, Libao; Zhu, Zhiming
Journal: SOLID STATE COMMUNICATIONS. 2023; Vol. 360, Issue , pp. -. DOI: 10.1016/j.ssc.2022.115048
Author: Wang, Youchun; Xie, Hui; Liu, Yunxian
Journal: SOLID STATE COMMUNICATIONS. 2023; Vol. 360, Issue , pp. -. DOI: 10.1016/j.ssc.2022.115054
Author: Zheng, Xiande; Farid, Muhammad Asim; Wang, Xiaoge; Wang, Yan; Geng, Jinling; Liao, Fuhui; Sun, Junliang; Li, Guobao; Liu, Laijun; Lin, Jianhua
Journal: SOLID STATE COMMUNICATIONS. 2023; Vol. 360, Issue , pp. -. DOI: 10.1016/j.ssc.2022.115051
Author: Zhao, Hong; Duan, Xiaoyang; Yu, Taolin; Xu, Dan; Zhao, Wenjie
Journal: SOLID STATE COMMUNICATIONS. 2023; Vol. 360, Issue , pp. -. DOI: 10.1016/j.ssc.2022.115050
Author: Fu, Chongyang; Li, Weiqi; Zeng, Chongyang; Zhang, Le; Liu, Zeen; Wu, Xiao; Ma, Xiaojuan
Journal: SOLID STATE COMMUNICATIONS. 2023; Vol. 368, Issue , pp. -. DOI: 10.1016/j.ssc.2023.115180
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