国际简称:COMPUT ELECTR ENG 参考译名:计算机与电气工程
主要研究方向:工程技术-工程:电子与电气 非预警期刊 审稿周期:约8.9 weeks 约12.0个月
《计算机与电气工程》(Computers & Electrical Engineering)是一本由Elsevier Ltd出版的以工程技术-工程:电子与电气为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。
The impact of computers has nowhere been more revolutionary than in electrical engineering. The design, analysis, and operation of electrical and electronic systems are now dominated by computers, a transformation that has been motivated by the natural ease of interface between computers and electrical systems, and the promise of spectacular improvements in speed and efficiency.
Published since 1973, Computers & Electrical Engineering provides rapid publication of topical research into the integration of computer technology and computational techniques with electrical and electronic systems. The journal publishes papers featuring novel implementations of computers and computational techniques in areas like signal and image processing, high-performance computing, parallel processing, and communications. Special attention will be paid to papers describing innovative architectures, algorithms, and software tools.
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||||||
9.2 | 1.041 | 1.395 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 3区 | COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 3区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q1 | 11 / 59 |
82.2% |
学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS | SCIE | Q2 | 45 / 169 |
73.7% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 100 / 352 |
71.7% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q2 | 16 / 59 |
73.73% |
学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS | SCIE | Q2 | 49 / 169 |
71.3% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 99 / 354 |
72.18% |
Author: Zhao, Kai; Li, Boyuan; Zhang, Kai; Liu, Ruoyu; Gao, Long; Shu, Xujun; Liu, Minghang; Yang, Xuejun; Chen, Shengbo; Sun, Guochen
Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108482
Author: Zhang, Botong; Tian, Lihua; Li, Chen; Yang, Yi
Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108525
Author: Wu, Yun; Wu, Liangshun; Cai, Hengjin
Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108542
Author: Wang, Tiansheng; Liu, Zhonghua; Ou, Weihua; Huo, Hua
Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 108, Issue , pp. -. DOI: 10.1016/j.compeleceng.2023.108726
Author: Lv, Qiuying; Yang, Nannan; Slowik, Adam; Lv, Jianhui; Yousefpour, Amin
Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 108, Issue , pp. -. DOI: 10.1016/j.compeleceng.2023.108722
Author: Sheng, Zhaoyu; Lv, Zhiqiang; Li, Jianbo; Xu, Zhihao; Sun, Haokai; Liu, Xue; Ye, Rongkun
Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108530
Author: Chen, Zhe; Qiu, Nan; Feng, Hui; Dai, Dongfang
Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108545
Author: Wu, Yichun; Zhao, Huihuang; Liang, Xiaoman; Sun, Yaqi
Journal: COMPUTERS & ELECTRICAL ENGINEERING. 2023; Vol. 105, Issue , pp. -. DOI: 10.1016/j.compeleceng.2022.108534
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