国际简称:IEEE T KNOWL DATA EN 参考译名:IEEE知识与数据工程汇刊
主要研究方向:工程技术-工程:电子与电气 非预警期刊 审稿周期: 一般,3-8周
《IEEE知识与数据工程汇刊》(Ieee Transactions On Knowledge And Data Engineering)是一本由IEEE Computer Society出版的以工程技术-工程:电子与电气为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。该期刊享有很高的科学声誉,影响因子不断增加,发行量也同样高。
The scope includes the knowledge and data engineering aspects of computer science, artificial intelligence, electrical engineering, computer engineering, and other appropriate fields. This Transactions provides an international and interdisciplinary forum to communicate results of new developments in knowledge and data engineering and the feasibility studies of these ideas in hardware and software. Specific areas to be covered are as follows: Fields and Areas of Knowledge and Data Engineering: (a) Knowledge and data engineering aspects of knowledge based and expert systems, (b) Artificial Intelligence techniques relating to knowledge and data management, (c) Knowledge and data engineering tools and techniques, (d) Distributed knowledge base and database processing, (e) Real-time knowledge bases and databases, (f) Architectures for knowledge and data based systems, (g) Data management methodologies, (h) Database design and modeling, (i) Query, design, and implementation languages, (j) Integrity, security, and fault tolerance, (k) Distributed database control, (l) Statistical databases, (m) System integration and modeling of these systems, (n) Algorithms for these systems, (o) Performance evaluation of these algorithms, (p) Data communications aspects of these systems, and (q) Applications of these systems.
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||||||
11.7 | 2.867 | 3.577 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能 COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 1区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能 COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 2区 | COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能 COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能 COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能 COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 2区 2区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE | SCIE | Q1 | 17 / 197 |
91.6% |
学科:COMPUTER SCIENCE, INFORMATION SYSTEMS | SCIE | Q1 | 5 / 249 |
98.2% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q1 | 13 / 352 |
96.4% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE | SCIE | Q1 | 10 / 198 |
95.2% |
学科:COMPUTER SCIENCE, INFORMATION SYSTEMS | SCIE | Q1 | 7 / 251 |
97.41% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q1 | 8 / 354 |
97.88% |
Author: Zuo, Yuan; Li, Congrui; Lin, Hao; Wu, Junjie
Journal: IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING. 2023; Vol. 35, Issue 1, pp. 972-985. DOI: 10.1109/TKDE.2021.3073195
Author: Zhu, Tianyu; Sun, Leilei; Chen, Guoqing
Journal: IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING. 2023; Vol. 35, Issue 1, pp. 496-508. DOI: 10.1109/TKDE.2021.3073411
Author: Zhu, Tianyu; Sun, Leilei; Chen, Guoqing
Journal: IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING. 2023; Vol. 35, Issue 1, pp. 431-442. DOI: 10.1109/TKDE.2021.3087791
Author: Zhou, Qinghai; Li, Liangyue; Cao, Nan; Ying, Lei; Tong, Hanghang
Journal: IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING. 2023; Vol. 35, Issue 1, pp. 96-107. DOI: 10.1109/TKDE.2021.3078634
Author: Zhou, Jiajun; Chen, Zhi; Du, Min; Chen, Lihong; Yu, Shanqing; Chen, Guanrong; Xuan, Qi
Journal: IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING. 2023; Vol. 35, Issue 1, pp. 842-856. DOI: 10.1109/TKDE.2021.3088844
Author: Zheng, Qinghai; Zhu, Jihua; Tang, Haoyu; Liu, Xinyuan; Li, Zhongyu; Lu, Huimin
Journal: IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING. 2023; Vol. 35, Issue 1, pp. 482-495. DOI: 10.1109/TKDE.2021.3073157
Author: Zheng, Libin; Chen, Lei; Shahabi, Cyrus
Journal: IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING. 2023; Vol. 35, Issue 1, pp. 154-166. DOI: 10.1109/TKDE.2021.3073983
Author: Zhao, Zhanhao; Lu, Wei; Zhao, Hongyao; He, Zongyan; Li, Haixiang; Pan, Anqun; Du, Xiaoyong
Journal: IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING. 2023; Vol. 35, Issue 1, pp. 1028-1042. DOI: 10.1109/TKDE.2021.3081717
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