国际简称:IEEE T MOBILE COMPUT 参考译名:IEEE 移动计算交易
主要研究方向:工程技术-电信学 非预警期刊 审稿周期: 约7.5个月
《IEEE 移动计算交易》(Ieee Transactions On Mobile Computing)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技术-电信学为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。该期刊享有很高的科学声誉,影响因子不断增加,发行量也同样高。
IEEE Transactions on Mobile Computing focuses on the key technical issues related to (a) architectures, (b) support services, (c) algorithm/protocol design and analysis, (d) mobile environments, (e) mobile communication systems, (f) applications, and (g) emerging technologies. Topics of interest include, but are not limited to, the following: a) Architectures - Mobile networks and hosts, Agents and proxies, Mobility management, mobile agent and proxy architectures Integrated wireline and wireless systems, Planning and standardization. b) Support Services - Mobility and roaming, Nomadic computing, Multimedia Operating system support, Power management. c) Algorithm/Protocol Design and Analysis - Online and mobile environments, Limited bandwidth, Intermittent connectivity. d) Mobile Environments - Data and knowledge management, Performance modeling and characterization, Security, scalability and reliability, Design, management and operation, Systems and technologies. e) Mobile Communication Systems - Wireless, cellular and spread-spectrum systems, Multi-user and multi-access techniques and algorithms, Multi-channel processing, Channel coding, Data coding and compression. f) Applications - Location-dependent and sensitive, Nomadic computing, Wearable computers and body area networks, Multimedia applications and multimedia signal processing, Pervasive computing, Wireless sensor networks. g) Emerging Technologies.
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||||||
12.9 | 2.755 | 2.15 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
是 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 TELECOMMUNICATIONS 电信学 | 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 TELECOMMUNICATIONS 电信学 | 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 TELECOMMUNICATIONS 电信学 | 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 2区 | COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 TELECOMMUNICATIONS 电信学 | 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 计算机科学 | 2区 | COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 TELECOMMUNICATIONS 电信学 | 2区 2区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
是 | 否 | 计算机科学 | 1区 | COMPUTER SCIENCE, INFORMATION SYSTEMS 计算机:信息系统 TELECOMMUNICATIONS 电信学 | 1区 2区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, INFORMATION SYSTEMS | SCIE | Q1 | 11 / 249 |
95.8% |
学科:TELECOMMUNICATIONS | SCIE | Q1 | 9 / 119 |
92.9% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, INFORMATION SYSTEMS | SCIE | Q1 | 11 / 251 |
95.82% |
学科:TELECOMMUNICATIONS | SCIE | Q1 | 6 / 119 |
95.38% |
Author: Zhu, Xiaoqiang; Qiu, Tie; Qu, Wenyu; Zhou, Xiaobo; Atiquzzaman, Mohammed; Wu, Dapeng Oliver
Journal: IEEE TRANSACTIONS ON MOBILE COMPUTING. 2023; Vol. 22, Issue 1, pp. 115-128. DOI: 10.1109/TMC.2021.3073005
Author: Zhu, Shaopeng; Zheng, Xiaolong; Liu, Liang; Ma, Huadong
Journal: IEEE TRANSACTIONS ON MOBILE COMPUTING. 2023; Vol. 22, Issue 1, pp. 69-83. DOI: 10.1109/TMC.2021.3070644
Author: Zhu, Hongzi; Wang, Xiao; Jiang, Yi; Chang, Shan; Wang, Xudong
Journal: IEEE TRANSACTIONS ON MOBILE COMPUTING. 2023; Vol. 22, Issue 1, pp. 515-526. DOI: 10.1109/TMC.2021.3069981
Author: Zhang, Guanghui; Liu, Ke; Hu, Haibo; Aggarwal, Vaneet; Lee, Jack Y. B.
Journal: IEEE TRANSACTIONS ON MOBILE COMPUTING. 2023; Vol. 22, Issue 1, pp. 389-401. DOI: 10.1109/TMC.2021.3069764
Author: Xie, Qinge; Gong, Qingyuan; He, Xinlei; Chen, Yang; Wang, Xin; Zheng, Haitao; Zhao, Ben Y.
Journal: IEEE TRANSACTIONS ON MOBILE COMPUTING. 2023; Vol. 22, Issue 1, pp. 556-573. DOI: 10.1109/TMC.2021.3088121
Author: Xie, Hong; Lui, John C. S.
Journal: IEEE TRANSACTIONS ON MOBILE COMPUTING. 2023; Vol. 22, Issue 1, pp. 459-471. DOI: 10.1109/TMC.2021.3072477
Author: Wu, Weiqi; Wang, Xingfu; Hawbani, Ammar; Liu, Ping; Zhao, Liang; Al-Dubai, Ahmed
Journal: IEEE TRANSACTIONS ON MOBILE COMPUTING. 2023; Vol. 22, Issue 1, pp. 253-268. DOI: 10.1109/TMC.2021.3074739
Author: Wang, Haibo; Xu, Hongli; Huang, He; Chen, Min; Chen, Shigang
Journal: IEEE TRANSACTIONS ON MOBILE COMPUTING. 2023; Vol. 22, Issue 1, pp. 500-514. DOI: 10.1109/TMC.2021.3068748
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