首页 > SCI 期刊 > 工程技术 > Ieee Transactions On Very Large Scale Integration (vlsi) Systems(非官网)

同大类学科其它级别期刊：

中科院 1区期刊 JCR Q1 期刊中科院 2区期刊 JCR Q2 期刊中科院 3区期刊 JCR Q3 期刊中科院 4区期刊 JCR Q4 期刊

Ieee Transactions On Very Large Scale Integration (vlsi) Systems SCIE

国际简称：IEEE T VLSI SYST 参考译名：超大规模集成 (vlsi) 系统上的 Ieee 事务

主要研究方向：工程技术-工程：电子与电气非预警期刊审稿周期：一般,3-6周

《超大规模集成 (vlsi) 系统上的 Ieee 事务》(Ieee Transactions On Very Large Scale Integration (vlsi) Systems)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技术-工程：电子与电气为研究特色的国际期刊，发表该领域相关的原创研究文章、评论文章和综述文章，及时报道该领域相关理论、实践和应用学科的最新发现，旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊，近三年没有被列入预警名单。该期刊享有很高的科学声誉，影响因子不断增加，发行量也同样高。

2区中科院分区
Q2 JCR分区
241 年发文量
2.8 IF影响因子
未开放 是否OA
95 H-index
1993 创刊年份
Bimonthly 出版周期
English 出版语言

The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.

Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.

To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.

[ 查看全部 ]

投稿咨询加急咨询

投稿热线：400-888-7501

Ieee Transactions On Very Large Scale Integration (vlsi) Systems期刊信息

ISSN：1063-8210
出版语言：English
是否OA：未开放
E-ISSN：1557-9999
出版地区：UNITED STATES
是否预警：否
出版商：Institute of Electrical and Electronics Engineers Inc.
出版周期：Bimonthly
创刊时间：1993
开源占比：0.0933
Gold OA文章占比：7.13%
OA被引用占比：0
出版国人文章占比：0.15
出版撤稿占比：0
研究类文章占比：99.59%

Ieee Transactions On Very Large Scale Integration (vlsi) Systems CiteScore评价数据（2024年最新版）

CiteScore

SJR

SNIP

CiteScore 指数

6.4

0.937

1.516

学科类别	分区	排名	百分位
大类：Engineering 小类：Electrical and Electronic Engineering	Q1	195 / 797	75%
大类：Engineering 小类：Hardware and Architecture	Q2	51 / 177	71%
大类：Engineering 小类：Software	Q2	124 / 407	69%

名词解释：CiteScore 是衡量期刊所发表文献的平均受引用次数，是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年（含计算年度）的被引次数除以该期刊近四年发表的文献数。例如，2022年的 CiteScore 计算方法为：2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量注：文献类型包括：文章、评论、会议论文、书籍章节和数据论文。

Ieee Transactions On Very Large Scale Integration (vlsi) Systems中科院评价数据

中科院 2023年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	2区	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	2区 3区

中科院 2022年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	2区	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	3区 3区

中科院 2021年12月旧的升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	3区 3区

中科院 2021年12月基础版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	4区	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	4区 4区

中科院 2021年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	3区	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	3区 3区

中科院 2020年12月旧的升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	2区	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机：硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	3区 3区

Ieee Transactions On Very Large Scale Integration (vlsi) Systems JCR评价数据（2023-2024年最新版）

按JIF指标学科分区	收录子集	分区	排名	百分位
学科：COMPUTER SCIENCE, HARDWARE & ARCHITECTURE	SCIE	Q2	23 / 59	61.9%
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	151 / 352	57.2%

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：COMPUTER SCIENCE, HARDWARE & ARCHITECTURE	SCIE	Q2	26 / 59	56.78%
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q2	149 / 354	58.05%

Ieee Transactions On Very Large Scale Integration (vlsi) Systems历年数据统计

影响因子

中科院分区

Ieee Transactions On Very Large Scale Integration (vlsi) Systems中国学者发文选摘

1、A Low-Cost Reduced-Latency DRAM Architecture With Dynamic Reconfiguration of Row Decoder
Author: Bai, Fujun; Wang, Song; Jia, Xuerong; Guo, Yixin; Yu, Bing; Wang, Hang; Lai, Cong; Ren, Qiwei; Sun, Hongbin

Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 128-141. DOI: 10.1109/TVLSI.2022.3219437
2、A Security-Enhanced, Charge-Pump-Free, ISO14443-A-/ISO10373-6-Compliant RFID Tag With 16.2-mu W Embedded RRAM and Reconfigurable Strong PUF
Author: Ren, Qirui; Huo, Qiang; Chen, Zhisheng; Gao, Qi; Wang, Yiming; Yang, Yiming; Wu, Hao; Fu, Xiangqu; Xu, Xiaoxin; Luo, Qing; Gao, Jianfeng; Chen, Chengying; Zhao, Xiaojin; Lei, Dengyun; Wang, Xinghua; Zhang, Feng; Chen, Yong; Mak, Pui-In

Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 243-252. DOI: 10.1109/TVLSI.2022.3222522
3、A 4.5-W, 18.5-24.5-GHz GaN Power Amplifier Employing Chebyshev Matching Technique
Author: Wang, Yujia; Zhang, Jincheng; Chen, Yong; Ren, Junyan; Ma, Shunli

Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 233-242. DOI: 10.1109/TVLSI.2022.3225967
4、Fast Estimation of a Statistical Eye Diagram for Nonlinear High-Speed Links Based on the Minimum Required Order of the Multiple Edge Response Method
Author: Wang, Jun; Luo, Yuhuan; Guo, Wenting; Wu, Feng; Chu, Xiuqin

Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 210-218. DOI: 10.1109/TVLSI.2022.3225533
5、Multiple-Mode-Supporting Floating-Point FMA Unit for Deep Learning Processors
Author: Tan, Hongbing; Tong, Gan; Huang, Libo; Xiao, Liquan; Xiao, Nong

Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 253-266. DOI: 10.1109/TVLSI.2022.3226185
6、A High-Speed Low-Noise Comparator With Auxiliary-Inverter-Based Common Mode-Self-Regulation for Low-Supply-Voltage SAR ADCs
Author: Qiu, Lei; Meng, Tianyi; Yao, Bingbing; Du, Zihao; Yuan, Xiaohua

Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 152-156. DOI: 10.1109/TVLSI.2022.3224237
7、BitXpro: Regularity-Aware Hardware Runtime Pruning for Deep Neural Networks
Author: Li, Hongyan; Lu, Hang; Wang, Haoxuan; Deng, Shengji; Li, Xiaowei

Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 90-103. DOI: 10.1109/TVLSI.2022.3221732
8、Reliability Evaluation and Fault Tolerance Design for FPGA Implemented Reed Solomon (RS) Erasure Decoders
Author: Gao, Zhen; Shi, Jinchang; Liu, Qiang; Ullah, Anees; Reviriego, Pedro

Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 142-146. DOI: 10.1109/TVLSI.2022.3224137