国际简称:IEEE T VLSI SYST 参考译名:超大规模集成 (vlsi) 系统上的 Ieee 事务
主要研究方向:工程技术-工程:电子与电气 非预警期刊 审稿周期: 一般,3-6周
《超大规模集成 (vlsi) 系统上的 Ieee 事务》(Ieee Transactions On Very Large Scale Integration (vlsi) Systems)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技术-工程:电子与电气为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。该期刊享有很高的科学声誉,影响因子不断增加,发行量也同样高。
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||||||
6.4 | 0.937 | 1.516 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 2区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 2区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 2区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 3区 3区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q2 | 23 / 59 |
61.9% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 151 / 352 |
57.2% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q2 | 26 / 59 |
56.78% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 149 / 354 |
58.05% |
Author: Bai, Fujun; Wang, Song; Jia, Xuerong; Guo, Yixin; Yu, Bing; Wang, Hang; Lai, Cong; Ren, Qiwei; Sun, Hongbin
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 128-141. DOI: 10.1109/TVLSI.2022.3219437
Author: Ren, Qirui; Huo, Qiang; Chen, Zhisheng; Gao, Qi; Wang, Yiming; Yang, Yiming; Wu, Hao; Fu, Xiangqu; Xu, Xiaoxin; Luo, Qing; Gao, Jianfeng; Chen, Chengying; Zhao, Xiaojin; Lei, Dengyun; Wang, Xinghua; Zhang, Feng; Chen, Yong; Mak, Pui-In
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 243-252. DOI: 10.1109/TVLSI.2022.3222522
Author: Wang, Yujia; Zhang, Jincheng; Chen, Yong; Ren, Junyan; Ma, Shunli
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 233-242. DOI: 10.1109/TVLSI.2022.3225967
Author: Wang, Jun; Luo, Yuhuan; Guo, Wenting; Wu, Feng; Chu, Xiuqin
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 210-218. DOI: 10.1109/TVLSI.2022.3225533
Author: Tan, Hongbing; Tong, Gan; Huang, Libo; Xiao, Liquan; Xiao, Nong
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 253-266. DOI: 10.1109/TVLSI.2022.3226185
Author: Qiu, Lei; Meng, Tianyi; Yao, Bingbing; Du, Zihao; Yuan, Xiaohua
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 152-156. DOI: 10.1109/TVLSI.2022.3224237
Author: Li, Hongyan; Lu, Hang; Wang, Haoxuan; Deng, Shengji; Li, Xiaowei
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 90-103. DOI: 10.1109/TVLSI.2022.3221732
Author: Gao, Zhen; Shi, Jinchang; Liu, Qiang; Ullah, Anees; Reviriego, Pedro
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 142-146. DOI: 10.1109/TVLSI.2022.3224137
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