国际简称:INTEGRATION 参考译名:集成-Vlsi Journal
主要研究方向:工程技术-工程:电子与电气 非预警期刊 审稿周期: 12周,或约稿 约12.8周
《集成-Vlsi Journal》(Integration-the Vlsi Journal)是一本由Elsevier出版的以工程技术-工程:电子与电气为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。
Integration's aim is to cover every aspect of the VLSI area, with an emphasis on cross-fertilization between various fields of science, and the design, verification, test and applications of integrated circuits and systems, as well as closely related topics in process and device technologies. Individual issues will feature peer-reviewed tutorials and articles as well as reviews of recent publications. The intended coverage of the journal can be assessed by examining the following (non-exclusive) list of topics:
Specification methods and languages; Analog/Digital Integrated Circuits and Systems; VLSI architectures; Algorithms, methods and tools for modeling, simulation, synthesis and verification of integrated circuits and systems of any complexity; Embedded systems; High-level synthesis for VLSI systems; Logic synthesis and finite automata; Testing, design-for-test and test generation algorithms; Physical design; Formal verification; Algorithms implemented in VLSI systems; Systems engineering; Heterogeneous systems.
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||||||
3.8 | 0.3 | 0.829 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 3区 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 4区 4区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q3 | 32 / 59 |
46.6% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q3 | 183 / 352 |
48.2% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q3 | 39 / 59 |
34.75% |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q3 | 212 / 354 |
40.25% |
Author: Pang, Liang; Wang, Ziqi; Shi, Rui; Yao, Mengyun; Shi, Xiao; Yan, Hao; Shi, Longxin
Journal: INTEGRATION-THE VLSI JOURNAL. 2023; Vol. 89, Issue , pp. 155-167. DOI: 10.1016/j.vlsi.2022.11.015
Author: Li, Jian-De; Wang, Sying-Jyan; Li, Katherine Shu-Min; Ho, Tsung-Yi
Journal: INTEGRATION-THE VLSI JOURNAL. 2023; Vol. 89, Issue , pp. 185-196. DOI: 10.1016/j.vlsi.2022.11.013
Author: Zhou, Wu; Ouyang, Yiming; Li, Jianhua; Xu, Dongyu
Journal: INTEGRATION-THE VLSI JOURNAL. 2023; Vol. 88, Issue , pp. 286-297. DOI: 10.1016/j.vlsi.2022.10.004
Author: Zhou, Jindong; Chen, Yuyang; Jing, Youliang; Zhou, Pingqiang
Journal: INTEGRATION-THE VLSI JOURNAL. 2023; Vol. 88, Issue , pp. 196-202. DOI: 10.1016/j.vlsi.2022.09.017
Author: Zhou, Chen-Can; Qiu, Jie; Cao, Yang; Yang, Geng-Chen; Shen, Qin-Qin; Shi, Quan
Journal: INTEGRATION-THE VLSI JOURNAL. 2023; Vol. 88, Issue , pp. 20-31. DOI: 10.1016/j.vlsi.2022.08.010
Author: Zhao, Yunan; Hou, Haomin; Zhang, Shuhao; Wang, Hao; Chang, Sheng; Huang, Qijun; He, Jin
Journal: INTEGRATION-THE VLSI JOURNAL. 2023; Vol. 88, Issue , pp. 101-107. DOI: 10.1016/j.vlsi.2022.09.007
Author: Zhang, Li; Lv, Qishen; Gao, Di; Zhou, Xian; Meng, Wenchao; Yang, Qinmin; Zhuo, Cheng
Journal: INTEGRATION-THE VLSI JOURNAL. 2023; Vol. 88, Issue , pp. 241-248. DOI: 10.1016/j.vlsi.2022.10.006
Author: Zhang, Chenkai; Du, Baoxiang
Journal: INTEGRATION-THE VLSI JOURNAL. 2023; Vol. 88, Issue , pp. 328-342. DOI: 10.1016/j.vlsi.2022.10.003
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