国际简称:INT J NUMER MODEL EL 参考译名:国际数值建模杂志-电子网络设备与技术
主要研究方向:工程技术-工程:电子与电气 非预警期刊 审稿周期: 12周,或约稿
《国际数值建模杂志-电子网络设备与技术》(International Journal Of Numerical Modelling-electronic Networks Devices And Fie)是一本由John Wiley and Sons Ltd出版的以工程技术-工程:电子与电气为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。
Prediction through modelling forms the basis of engineering design. The computational power at the fingertips of the professional engineer is increasing enormously and techniques for computer simulation are changing rapidly. Engineers need models which relate to their design area and which are adaptable to new design concepts. They also need efficient and friendly ways of presenting, viewing and transmitting the data associated with their models.
The International Journal of Numerical Modelling: Electronic Networks, Devices and Fields provides a communication vehicle for numerical modelling methods and data preparation methods associated with electrical and electronic circuits and fields. It concentrates on numerical modelling rather than abstract numerical mathematics.
Contributions on numerical modelling will cover the entire subject of electrical and electronic engineering. They will range from electrical distribution networks to integrated circuits on VLSI design, and from static electric and magnetic fields through microwaves to optical design. They will also include the use of electrical networks as a modelling medium.
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||||||
4.6 | 0.43 | 0.682 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 数学跨学科应用 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 数学跨学科应用 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 数学跨学科应用 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 数学跨学科应用 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 数学跨学科应用 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 数学跨学科应用 | 4区 4区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q3 | 239 / 352 |
32.2% |
学科:MATHEMATICS, INTERDISCIPLINARY APPLICATIONS | SCIE | Q3 | 70 / 135 |
48.5% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q3 | 200 / 354 |
43.64% |
学科:MATHEMATICS, INTERDISCIPLINARY APPLICATIONS | SCIE | Q3 | 82 / 135 |
39.63% |
Author: Song, Zelin; Liu, Huihua; Mawuli, Ernest Smith; Yu, Yiming; Zhao, Chenxi; Wu, Yunqiu; Tang, Hongyan; Kang, Kai
Journal: INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS. 2023; Vol. 36, Issue 1, pp. -. DOI: 10.1002/jnm.3026
Author: Yao, Yufei; Jiang, Xuecheng; Gu, Yan; Yang, Guofeng; Wei, Chunlei; Xie, Zhijian; Zhang, Qi; Qian, Weiying; Zhu, Chun
Journal: INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS. 2023; Vol. 36, Issue 1, pp. -. DOI: 10.1002/jnm.3028
Author: Xing, Zhao; Liu, Huihua; Wu, Yunqiu; Zhao, Chenxi; Yu, Yiming; Kang, Kai
Journal: INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS. 2023; Vol. 36, Issue 1, pp. -. DOI: 10.1002/jnm.3037
Author: Wu, Dehui; Lin, Shibin; Chen, Hongfu; Wang, Xiaohong
Journal: INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS. 2023; Vol. 36, Issue 1, pp. -. DOI: 10.1002/jnm.3038
Author: Wu, Shihong; Dong, Yunyun; Liu, Lining; Su, Feng; Chen, Xiangguang
Journal: INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS. 2023; Vol. 36, Issue 2, pp. -. DOI: 10.1002/jnm.3057
Author: Xu, Aiqin; Wu, Jing; Zhou, Guoliang
Journal: INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS. 2023; Vol. , Issue , pp. -. DOI: 10.1002/jnm.3087
Author: Dai, Xi Wang; Hu, Wen Hao; Fu, Yang Hui; Liu, Jie; Chen, Zhi Xi
Journal: INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS. 2023; Vol. , Issue , pp. -. DOI: 10.1002/jnm.3102
Author: Zhao, Yunru; Wu, Qi
Journal: INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS. 2023; Vol. , Issue , pp. -. DOI: 10.1002/jnm.3104
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