国际简称:J COMPUT INF SCI ENG 参考译名:工程计算与信息科学杂志
主要研究方向:工程技术-工程:制造 非预警期刊 审稿周期: 12周,或约稿
《工程计算与信息科学杂志》(Journal Of Computing And Information Science In Engineering)是一本由American Society of Mechanical Engineers(ASME)出版的以工程技术-工程:制造为研究特色的国际期刊,发表该领域相关的原创研究文章、评论文章和综述文章,及时报道该领域相关理论、实践和应用学科的最新发现,旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊,近三年没有被列入预警名单。
The ASME Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to Algorithms, Computational Methods, Computing Infrastructure, Computer-Interpretable Representations, Human-Computer Interfaces, Information Science, and/or System Architectures that aim to improve some aspect of product and system lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, recycling etc.). Applications considered in JCISE manuscripts should be relevant to the mechanical engineering discipline. Papers can be focused on fundamental research leading to new methods, or adaptation of existing methods for new applications.
Scope: Advanced Computing Infrastructure; Artificial Intelligence; Big Data and Analytics; Collaborative Design; Computer Aided Design; Computer Aided Engineering; Computer Aided Manufacturing; Computational Foundations for Additive Manufacturing; Computational Foundations for Engineering Optimization; Computational Geometry; Computational Metrology; Computational Synthesis; Conceptual Design; Cybermanufacturing; Cyber Physical Security for Factories; Cyber Physical System Design and Operation; Data-Driven Engineering Applications; Engineering Informatics; Geometric Reasoning; GPU Computing for Design and Manufacturing; Human Computer Interfaces/Interactions; Industrial Internet of Things; Knowledge Engineering; Information Management; Inverse Methods for Engineering Applications; Machine Learning for Engineering Applications; Manufacturing Planning; Manufacturing Automation; Model-based Systems Engineering; Multiphysics Modeling and Simulation; Multiscale Modeling and Simulation; Multidisciplinary Optimization; Physics-Based Simulations; Process Modeling for Engineering Applications; Qualification, Verification and Validation of Computational Models; Symbolic Computing for Engineering Applications; Tolerance Modeling; Topology and Shape Optimization; Virtual and Augmented Reality Environments; Virtual Prototyping
CiteScore | SJR | SNIP | CiteScore 指数 | ||||||||||||||||||||
6.3 | 0.768 | 0.96 |
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名词解释:CiteScore 是衡量期刊所发表文献的平均受引用次数,是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年(含计算年度)的被引次数除以该期刊近四年发表的文献数。例如,2022年的 CiteScore 计算方法为:2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量 注:文献类型包括:文章、评论、会议论文、书籍章节和数据论文。
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 3区 | COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, MANUFACTURING 工程:制造 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, MANUFACTURING 工程:制造 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, MANUFACTURING 工程:制造 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, MANUFACTURING 工程:制造 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, MANUFACTURING 工程:制造 | 4区 4区 |
Top期刊 | 综述期刊 | 大类学科 | 小类学科 | ||
否 | 否 | 工程技术 | 4区 | COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, MANUFACTURING 工程:制造 | 4区 4区 |
按JIF指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS | SCIE | Q2 | 80 / 169 |
53% |
学科:ENGINEERING, MANUFACTURING | SCIE | Q2 | 33 / 68 |
52.2% |
按JCI指标学科分区 | 收录子集 | 分区 | 排名 | 百分位 |
学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS | SCIE | Q3 | 99 / 169 |
41.72% |
学科:ENGINEERING, MANUFACTURING | SCIE | Q2 | 33 / 68 |
52.21% |
Author: Malashkhia, Luka; Liu, Dehao; Lu, Yanglong; Wang, Yan
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Journal: JOURNAL OF COMPUTING AND INFORMATION SCIENCE IN ENGINEERING. 2023; Vol. 23, Issue 2, pp. -. DOI: 10.1115/1.4054305
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