Microelectronics Reliability SCIE

国际简称：MICROELECTRON RELIAB 参考译名：微电子可靠性

主要研究方向：工程技术-工程：电子与电气非预警期刊审稿周期：较快,2-4周约8.3周

《微电子可靠性》(Microelectronics Reliability)是一本由Elsevier Ltd出版的以工程技术-工程：电子与电气为研究特色的国际期刊，发表该领域相关的原创研究文章、评论文章和综述文章，及时报道该领域相关理论、实践和应用学科的最新发现，旨在促进该学科领域科学信息的快速交流。该期刊是一本未开放期刊，近三年没有被列入预警名单。

4区中科院分区
Q3 JCR分区
310 年发文量
1.6 IF影响因子
未开放 是否OA
80 H-index
1964 创刊年份
Monthly 出版周期
English 出版语言

Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.

Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.

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Microelectronics Reliability期刊信息

ISSN：0026-2714
出版语言：English
是否OA：未开放
E-ISSN：1872-941X
出版地区：ENGLAND
是否预警：否
出版商：Elsevier Ltd
出版周期：Monthly
创刊时间：1964
开源占比：0.0623
Gold OA文章占比：14.36%
OA被引用占比：0.0216...
出版国人文章占比：0
出版撤稿占比：0.0058...
研究类文章占比：98.39%

Microelectronics Reliability CiteScore评价数据（2024年最新版）

CiteScore

SJR

SNIP

CiteScore 指数

3.3

0.394

0.801

学科类别	分区	排名	百分位
大类：Engineering 小类：Safety, Risk, Reliability and Quality	Q2	83 / 207	60%
大类：Engineering 小类：Electrical and Electronic Engineering	Q2	395 / 797	50%
大类：Engineering 小类：Atomic and Molecular Physics, and Optics	Q3	118 / 224	47%
大类：Engineering 小类：Condensed Matter Physics	Q3	230 / 434	47%
大类：Engineering 小类：Surfaces, Coatings and Films	Q3	74 / 132	44%
大类：Engineering 小类：Electronic, Optical and Magnetic Materials	Q3	161 / 284	43%

名词解释：CiteScore 是衡量期刊所发表文献的平均受引用次数，是在 Scopus 中衡量期刊影响力的另一个指标。当年CiteScore 的计算依据是期刊最近4年（含计算年度）的被引次数除以该期刊近四年发表的文献数。例如，2022年的 CiteScore 计算方法为：2022年的 CiteScore =2019-2022年收到的对2019-2022年发表的文件的引用数量÷2019-2022年发布的文献数量注：文献类型包括：文章、评论、会议论文、书籍章节和数据论文。

Microelectronics Reliability中科院评价数据

中科院 2023年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理：应用	4区 4区 4区

中科院 2022年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理：应用	4区 4区 4区

中科院 2021年12月旧的升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理：应用	4区 4区 4区

中科院 2021年12月基础版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理：应用	4区 4区 4区

中科院 2021年12月升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理：应用	4区 4区 4区

中科院 2020年12月旧的升级版

Top期刊	综述期刊	大类学科		小类学科
否	否	工程技术	4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理：应用	4区 4区 4区

Microelectronics Reliability JCR评价数据（2023-2024年最新版）

按JIF指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q3	239 / 352	32.2%
学科：NANOSCIENCE & NANOTECHNOLOGY	SCIE	Q4	113 / 140	19.6%
学科：PHYSICS, APPLIED	SCIE	Q3	131 / 179	27.1%

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q4	272 / 354	23.31%
学科：NANOSCIENCE & NANOTECHNOLOGY	SCIE	Q4	114 / 140	18.93%
学科：PHYSICS, APPLIED	SCIE	Q4	140 / 179	22.07%

Microelectronics Reliability历年数据统计

影响因子

中科院分区

Microelectronics Reliability中国学者发文选摘

1、Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder
Author: Xu, Fengxian; Zhu, Wenjia; Yan, Jikang; Zhao, Lingyan; Lv, Jinmei

Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 140, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114883
2、Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation
Author: Xiang, Meiju; Wang, Duowei; He, Mu; Rui, Guo; Ma, Yao; Zhu, Xuhao; Mei, Fan; Gong, Min; Li, Yun; Huang, Mingmin; Yang, Zhimei

Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114886
3、Small sample classification based on data enhancement and its application in flip chip defection
Author: Sha, Yuhua; He, Zhenzhi; Gutierrez, Hector; Du, Jiawei; Yang, Weiwei; Lu, Xiangning

Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114887
4、BP neural network for non-invasive IGBT junction temperature online detection
Author: Liu, Li; Peng, Qianlei; Jiang, Huaping; Ran, Li; Wang, Yang; Du, Changhong; Chen, Jian; Zhou, Hongbo; Chen, Yang; Peng, Zhiyuan

Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114882
5、Thermal stress and drop stress analysis based on 3D package reliability study
Author: Xue, Leyang; Li, Xiang; Zhang, Hao

Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114888
6、Study on the interface mechanism of copper migration failure in solder mask-substrate package
Author: Li, Yesu; Lin, Shengru; Chi, Panwang; Zou, Yuqiang; Yao, Weikai; Li, Ming; Gao, Liming

Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114891
7、Effect of temperature cycling on the leakage mechanism of TSV liner
Author: Chen, Si; Jian, Xiaodong; Li, Kai; Li, Guoyuan; Wang, Zhizhe; Yang, Xiaofeng; Fu, Zhiwei; Wang, Hongyue

Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114889
8、Simulation analysis of electromagnetic pulse susceptibility and hardening design for system-in-package SZ0501
Author: Li, Ning; Li, Yang; Guo, Yaxin; He, Chaohui

Journal: MICROELECTRONICS RELIABILITY. 2023; Vol. 141, Issue , pp. -. DOI: 10.1016/j.microrel.2022.114892